FORLAS

RESEARCH ASSOCIATION LASER TECHNOLOGY

Local Stiffening and Processing of Rigid-Flexible Circuits Based on Polysiloxane by Laser Radiation

Field of work:

An aluminium oxide doped polysiloxane foil, which is already copper laminated is used as a new, high-flexible basematerial for flexible circuit boards. This material shows good dielectric properties, a high thermal conductivity and is attractive from an environmental point of view. The test module of a functional device demonstrates the high technical innovation potential of this new substrate material. Despite the high flexibility of the substrate polymer printing pastes show a good adhesion strength. Therefore further circuit layers as well as electric components can be realized. As with structuring and assembling, this can be carried out in controlled, inexpensive 2-D-technologies. In the following step a 3-D shape will be ensued - bending points are provided for this in the layout. An interesting possibility is to reinforce the doped substrate locally with the help of laser irradiation. Bending points are able to be stabilized through this.